TIN-O-VATION

Leutz Lötsysteme and Emil Otto further cooperate in well-engineered product and process solutions for your optimized soldering process on the way to „zero-defect“ and reliable electronics. Highest accuracy of the devices, material compatibility, suitable efficient cleaning media and innovative flux solutions perfectly matched – join connection!

SMT Hybrid Packaging is the international rendezvous for providers of SMT equipment, components and services for use in the manufacturing of electronic equipment.

We will be exhibiting again this year and look forward to your visit.

You will find us on stand 128 in Hall 4.

We would also be pleased to send you a free one-day entry ticket. To obtain a ticket please send us an email headed "Messeticket (Exhibition ticket)" to This email address is being protected from spambots. You need JavaScript enabled to view it..

Visit us at our booth at SMT connect,
Hall 4 Booth 128, 7th to 9th May 2019 in Nuremberg.

As a process-accompanying equipment manufacturer, we work for our customers on the realization of the Smart Factory. With our latest developments, we enable the fixing and processing of various PCB shapes and types.

We will gladly to send you a free ticket. Please send us an e-mail with the topic "Fair Ticket" to This email address is being protected from spambots. You need JavaScript enabled to view it..

We are looking forward to your visit!

Visit us from 16 - 18 May 2017 at SMT Hybrid Packaging in Nuremberg. Hall 4 - Stand 128.

If you require an entrance ticket, please email us with the subject ‘SMT trade fair ticket’ to This email address is being protected from spambots. You need JavaScript enabled to view it. and we will send you a ticket free of charge.

We look forward to your visit!